Based on the industrial chain of integrated circuit materials, this paper analyzes and reveals the differences in the technological layout between China, the United States, and Japan in all links of the industrial chain to help the scientific and technological decision-making of China’s integrated circuit materials industry. Based on the data of papers and patents, this study adopts the bibliometric analysis method to carry out the analysis and research of technical layout differences. Specifically, by combing the industrial chain of integrated circuit materials, seven kinds of materials in each link of the industrial chain are defined, and the global papers and patent data of each material are obtained from the Web of Science and Incopat patent databases. Combined with the paper quality and patent value judgment standards, the application and publication trend difference analysis, organization number difference analysis, enterprise number difference analysis and technology difference analysis of China, the United States and Japan are carried out. In recent years, China has made progress in patents and papers in the integrated circuit materials industry chain. The proportion of high-value patents and highly cited papers continues to rise, but the performance of different materials in the industry chain could be better. China pays more attention to patent applications in the fields of silicon wafers and photoresists and pays more attention to paper publications in the fields of electronic gases and wet electronic chemicals. China has a slight advantage in the total number of patent application institutions, but there needs to be more institutions applying for high-value patents. It shows the characteristics of more papers and fewer institutions. Enterprises account for a large proportion of patent application institutions, and high-value patents are mainly concentrated in enterprises. There are differences in technical concerns between China, the United States and Japan, and the United States and Japan have some common concerns.