Abstract: In this paper, in-depth analyses of Electronics Resurgence Initiative (ERI), launched by DARPA in 2017, are conducted in terms of its background, three primary research thrusts, projects deployment and progress, and organization model. Further more, characteristics of its projects development and adjustment of its R&D focuses are analysed and compared respectively. Then, innovations of its organization model are presented, which consist of challenge-based public-private collaborative partnership, and the role of boosting technology transformation. Finally, some suggestions are putted forward to further strengthen the R&D strategic plans and its innovation implementation in semiconductor industry in China: clarify the top-level strategic plan in semiconductor industry, analyse the existing technology challenges, integrate the existing R&D foundation, and promote the iterative development of technology; create an open and shared military-civilian integration environment, play the bridge role of dual-use technology and form a closer collaborative model; improve the organization and management mode of technological innovation, maximize enabling combination of research and talents, and promote technology portfolio and application.

Key words: Electronics Resurgence Initiative, DARPA, Innovation Organization, Semiconductor Industry, Chip Industry, military-civilian integration