世界科技研究与发展 ›› 2024, Vol. 46 ›› Issue (2): 170-181.doi: 10.16507/j.issn.1006-6055.2023.10.001

• 科技政策与管理 • 上一篇    下一篇

芯片设计企业创新价值链锁定困境与破解——以华为海思为例

解佳龙1,2 王梦兰1   

  1. 1. 中南民族大学管理学院,武汉 430074;2. 湖北省产品创新管理研究中心,武汉 430070
  • 出版日期:2024-04-25 发布日期:2024-04-29
  • 基金资助:
    国家社会科学基金青年项目“国家自主创新示范区创新价值链锁定与突破路径研究”(21CGL051)

Locking Dilemma and Solution of the Innovation Value Chain in Chip Design Enterprises: Taking Huawei HiSilicon as an Example

XIE Jialong1,2   WANG Menglan1   

  1. 1. School of Management, South-Central Minzu University, Wuhan 430074, China; 2. Center for Product Innovation Management of Hubei, Wuhan 430070, China
  • Online:2024-04-25 Published:2024-04-29

摘要:

面对近年国外战略性掣肘的不断加压,我国芯片设计被锁定在产业创新价值链的低端,芯片设计企业如何摆脱低端循环以抢占产业发展制高点,成为我国芯片产业破局的关键。在分析我国芯片设计产业现状及其创新价值链地位的基础上,选取芯片设计领军企业华为海思作为研究对象,从研发水平、竞争对手、设计人才三方面探讨其陷入低端锁定困局的成因,并为解决低端锁定带来的企业发展易受制于人、失去主流市场应用机会、难以赢得资本市场青睐等不良影响,从知识储备、技术研发、人财保障、平台搭建和策略组合等维度提出破解策略,为我国芯片设计企业向创新价值链高端攀升提供对策建议。

关键词: 芯片设计, 创新价值链, 锁定困境, 破解策略, 华为海思

Abstract:

In the face of the constant pressure of strategic constraints from abroad in recent years, Chinese chip design is locked in the low-end of the industrial innovation value chain. How chip design enterprises get rid of the low-end cycle to seize the commanding heights of industrial development has become the key to breaking the market in the Chinese chip industry. Based on the analysis of the current situation of the Chinese chip design industry and its position in the innovation value chain, Huawei HiSilicon, a leading chip design enterprise, was selected as the research object to discuss the causes of its low-end lock-in from three aspects: R&D level, competitors and design talents. In order to solve the adverse effects of low-end locking, such as being easy to control by others, losing the application opportunities in the mainstream market, and difficult to win the favor of the capital market, this paper put forward the crack strategy from the aspects of knowledge reserve, technology research and development, human and financial security, platform building and strategy combination, and provided countermeasures and suggestions for Chinese chip design enterprises to climb the high end of the innovation value chain.

Key words: Chip Design, Innovation Value Chain, Locking Dilemma, Cracking Strategy, Huawei HiSilicon